83% off
10g Heat Sink Paste Thermal Grease Compound
-
This is a syringe of heatsink compound (aka thermal grease, thermal paste, thermal goo). Use this whenever you're connecting a component to a heatsink, it'll really help to dissipate even more potentially damaging heat.
-
This compound is composed of 50% silicone, 20% carbon, and 30% metal oxide. It has a good thermal conductivity, which should be plenty for voltage regulators, MOSFETs, motor drivers, audio amplifiers, etc.
- Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
- It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
- High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
- Package included 1 piece, Weight : Approx. 10 g,
- Material : Heat Sink Compound. Colour : Grey,
- High Grade Stability And Reliability.
- Apply to CPU, VGA, Chipset, Radiator And Other PC Components.
- Helps Disperse The Heat From CPU To Heatsink Effectively.
- Low Thermal Resistance And High Conductivity For Superior Heat Transfer.
- High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive.
Product Description:
|
Thermal conductivity
|
>1.9W/m-K
|
|
Thermal Impedance
|
<0.225°C-in2/W
|
|
Gravity
|
>2.0g/cm3
|
|
Viscosity
|
1000
|
|
Thixotropic Index
|
380±10 1/10mm
|
|
Operation Temperature(Peak)
|
-30~300°C
|
|
Moment Bore Temperature
|
-50~300°C
|
10g Heat Sink Paste Thermal Grease Compound
-
This is a syringe of heatsink compound (aka thermal grease, thermal paste, thermal goo). Use this whenever you're connecting a component to a heatsink, it'll really help to dissipate even more potentially damaging heat.
-
This compound is composed of 50% silicone, 20% carbon, and 30% metal oxide. It has a good thermal conductivity, which should be plenty for voltage regulators, MOSFETs, motor drivers, audio amplifiers, etc.
- Generally used as a thermal coupling of electrical / electronic devices to heat sinks such as base or mounting studs of transistors, diodes and rectifiers
- It is used for maintaining a positive heat-sink seal that improves heat transfer from the electrical / electronic component / device to the heat sink or chassis, there by increasing the overall efficiency of the component / device
- High thermal conductivity low thermal resistance electrically non-conductive, non-curing, non-capacitive, non-corrosive bleed resistant temp resistant from -50 to 210 C
- Package included 1 piece, Weight : Approx. 10 g,
- Material : Heat Sink Compound. Colour : Grey,
- High Grade Stability And Reliability.
- Apply to CPU, VGA, Chipset, Radiator And Other PC Components.
- Helps Disperse The Heat From CPU To Heatsink Effectively.
- Low Thermal Resistance And High Conductivity For Superior Heat Transfer.
- High Temperature Resistance. Non-toxic, Tasteless, Non-corrosive.
Product Description:
|
Thermal conductivity
|
>1.9W/m-K
|
|
Thermal Impedance
|
<0.225°C-in2/W
|
|
Gravity
|
>2.0g/cm3
|
|
Viscosity
|
1000
|
|
Thixotropic Index
|
380±10 1/10mm
|
|
Operation Temperature(Peak)
|
-30~300°C
|
|
Moment Bore Temperature
|
-50~300°C
|