High throughput SMT process solution

 

Sn/3.0Ag/0.5Cu

Deposition  Test Pattern: QFP Pad (fine pitch)

 

Stencil Thickness  : 130 microns
Stencil Material  : Stainless Steel
Printer   : DEK  ELAi
Printing Speed  : 60 mm/s
Stencil Separation  Speed  : 0.3 mm/s
Stencil Separation  Speed  : 40N
Atmosphere  : 25℃, 50%HR

Dyfenco HI-Q Solder Paste E9650-PN436T-T4 Lead free solder paste

SKU: TES00109
₹3,770.00Price
500 Grams