Dyfenco HI-Q Solder Paste SAC0307-PN436T-T4 Lead free solder paste

Dyfenco HI-Q Solder Paste SAC0307-PN436T-T4 Lead free solder paste

SKU: TES00101

High throughput SMT process solution

 

Sn/0.3Ag/0.7Cu

Deposition  Test Pattern: QFP Pad (fine pitch)

 

Stencil Thickness  : 130 microns
Stencil Material  : Stainless Steel
Printer   : DEK  ELAi
Printing Speed  : 60 mm/s
Stencil Separation  Speed  : 0.3 mm/s
Stencil Separation  Speed  : 40N
Atmosphere  : 25℃, 50%HR
    ₹2,460.00Price
    500 Grams

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