Dyfenco HI-Q Solder Paste SAC0307-PN436T-T4 Lead free solder paste

High throughput SMT process solution
 
Sn/0.3Ag/0.7Cu
Deposition  Test Pattern: QFP Pad (fine pitch)
 
	
		
			
Stencil Thickness  :
			
130 microns
		
		
			
Stencil Material  :
			
Stainless Steel
		
		
			
Printer   :
			
DEK  ELAi
		
		
			
Printing Speed  :
			
60 mm/s
		
		
			
Stencil Separation  Speed  :
			
0.3 mm/s
		
		
			
Stencil Separation  Speed  :
			
40N
		
		
			
Atmosphere  :
			
25℃, 50%HR