Dyfenco HI-Q Solder Paste SAC0307-PN436T-T4 Lead free solder paste
SKU: TES00101
High throughput SMT process solution
Sn/0.3Ag/0.7Cu
Deposition Test Pattern: QFP Pad (fine pitch)
Stencil Thickness : 130 microns Stencil Material : Stainless Steel Printer : DEK ELAi Printing Speed : 60 mm/s Stencil Separation Speed : 0.3 mm/s Stencil Separation Speed : 40N Atmosphere : 25℃, 50%HR
₹2,460.00Price
500 Grams