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RL-058 RELIFE 3 in 1 Chip Solder Set For PCB
The RL-058 RELIFE 3 in 1 Chip Solder Set is a professional-grade soldering solution designed for precision PCB rework, chip-level repairs, and micro-soldering applications on smartphones, tablets, and embedded systems. Electronics repair technicians, PCB assembly professionals, and mobile phone repair specialists rely on this comprehensive set to perform reliable solder joints on BGA, QFP, and fine-pitch components. This product solves the critical challenge of achieving consistent solder quality while minimizing thermal damage to sensitive PCB substrates and adjacent components during rework operations.
Product Overview
The RL-058 RELIFE 3 in 1 Chip Solder Set combines three essential soldering materials in one integrated package: lead-free solder paste, flux-cored solder wire, and liquid flux concentrate. This tri-component system works synergistically to ensure optimal wetting characteristics, reduced oxidation, and superior joint integrity across various PCB rework scenarios. The solder formulation meets RoHS compliance standards while maintaining excellent flowability at controlled temperatures, preventing cold solder joints and bridging defects that commonly occur in micro-soldering applications.
What distinguishes the RL-058 from standard soldering kits is its specifically engineered viscosity profile for chip-level work, where precision and minimal thermal impact are paramount. The included flux has been formulated to activate at lower temperatures, reducing the thermal stress window and protecting nearby components from heat damage. The solder paste exhibits excellent stencil printability and maintains consistent particle size distribution, critical for achieving uniform solder joints on densely populated PCBs. Professional repair centers across India choose this set for its reliability in high-volume rework environments and its consistent performance across seasonal temperature variations.
Key Specifications
| Specification | Details |
| Product Type | 3 in 1 Soldering Kit - Solder Paste, Solder Wire, and Flux |
| Brand | RELIFE |
| Origin | Original/Authentic |
| Warranty | 7 days on manufacturing defects |
| Shipping | 1-5 days from Bengaluru |
| Delivery | 7-8 days across India |
| Support | 24/7 via Email and WhatsApp |
| Solder Composition | Lead-free Sn/Ag/Cu alloy, RoHS compliant |
| Melting Point | 217-220 degrees Celsius |
| Flux Type | No-clean, water-soluble formulation |
| Solder Paste Viscosity | Optimized for micro-soldering applications |
Key Features
- Three-in-one comprehensive soldering solution eliminating the need for separate purchases and ensuring chemical compatibility across all components
- Lead-free solder paste with superior wetting characteristics and reduced bridging tendency on fine-pitch components and BGA pads
- Flux-cored solder wire with consistent core ratio for reliable joint formation during manual soldering and touch-up operations
- Professional-grade liquid flux concentrate with low residue formulation, reducing post-solder cleaning requirements and improving PCB aesthetics
- Optimized activation temperature profile minimizing thermal stress on sensitive IC packages and substrate materials
- Extended shelf life with proper storage, maintaining consistent performance across multiple rework projects
Applications and Use Cases
- Smartphone and tablet PCB rework including charging port repairs, power management IC replacements, and audio codec soldering on damaged boards
- Laptop and notebook motherboard repairs involving CPU, GPU, and memory module reballing and micro-soldering operations
- Industrial embedded systems and IoT device assembly where precision soldering and thermal management are critical for long-term reliability
- Consumer electronics repair including gaming consoles, smartwatches, and portable audio devices requiring fine-pitch component replacement
- PCB prototyping and small-batch manufacturing where consistent solder quality directly impacts device functionality and lifespan
- Educational and training environments for electronics repair technicians learning advanced micro-soldering techniques on real-world PCB assemblies
How to Use
Begin by preparing your PCB surface through thorough cleaning with isopropyl alcohol and a soft brush to remove oxidation and contaminants that prevent proper solder wetting. Apply a thin layer of the liquid flux concentrate directly onto the pads or components requiring soldering, then use the solder paste with a fine-tip applicator or micro-dispenser for precise placement on BGA pads or QFP leads. Heat the assembly using a controlled heat source such as a hot air station or infrared preheater, bringing the PCB to approximately 150-180 degrees Celsius before applying the soldering iron tip to the joint area.
Once the solder paste reaches its melting point, feed the flux-cored solder wire into the joint while maintaining consistent iron temperature between 350-380 degrees Celsius. The flux will activate automatically, promoting solder flow and wetting across the pad surface. Remove the iron once the solder forms a shiny, cone-shaped joint with smooth transitions to the pad edges. For BGA rework, apply solder paste to all ball positions, position the component carefully, and use a preheating profile followed by reflow heating to ensure simultaneous melting of all joints. Allow the assembly to cool naturally to room temperature before applying any mechanical stress or conducting electrical testing.
Frequently Asked Questions
What is the difference between lead-free and lead-based solder in the RL-058 set?
The RL-058 RELIFE set uses lead-free solder composition compliant with RoHS regulations, featuring a higher melting point of 217-220 degrees Celsius compared to traditional lead-based solder at 183 degrees Celsius. Lead-free formulations provide superior mechanical strength and thermal fatigue resistance, making them ideal for modern PCBs with fine-pitch components. However, they require slightly higher soldering temperatures and more precise flux management to achieve optimal wetting characteristics. The included flux in this set is specifically engineered to compensate for these requirements, ensuring reliable joints even with lead-free solder.
Can the RL-058 solder paste be used with stencil printing for mass production?
Yes, the solder paste component of the RL-058 set is specifically formulated for stencil printability with consistent viscosity and particle size distribution. The paste maintains excellent release characteristics from stencil apertures and exhibits minimal slump during the printing process. For optimal results with stencil printing, ensure your stencil thickness matches the component pitch and pad size, typically 0.125mm for fine-pitch applications. The paste remains workable for approximately 8-12 hours after stencil printing before oxidation begins to degrade print quality, making it suitable for both small-batch and moderate-volume production runs.
How should I store the RL-058 solder set to maintain product quality?
Store the solder paste in an airtight container at room temperature between 15-25 degrees Celsius, away from direct sunlight and moisture sources. Solder paste typically maintains optimal performance for 6-12 months from the manufacturing date when stored properly. The flux concentrate should be kept in its original sealed container to prevent evaporation of volatile components that affect activation temperature and wetting behavior. Solder wire should be stored in a dry environment and can remain usable for extended periods if protected from oxidation. Before using materials stored for extended periods, verify their performance on scrap PCB samples to ensure they meet your quality standards.
When will I receive my order?
Orders are dispatched within 1-5 business days from our Bengaluru warehouse. Delivery takes 7-8 days to most locations across India.
What is your return and warranty policy?
We offer a 7-day return policy on manufacturing defects only. Contact support within 7 days of receipt for free replacement or full refund. Not applicable for user damage or misuse.
Are bulk discounts available?
Yes, wholesale pricing for orders of 10 or more units. Contact our sales team via WhatsApp or email for a customized bulk quote.
Why Buy from The Engineer Store
- Genuine Products: Sourced directly from authorized distributors with authentication
- Expert Team: Our technical team validates every product before listing
- Fast Shipping: Dispatched within 1-5 days from our Bengaluru warehouse
- Pan-India Delivery: 7-8 days to Mumbai, Delhi, Chennai, Hyderabad, Pune, Kolkata
- Payment Options: COD, UPI, credit/debit cards, net banking, EMI available
- Technical Support: 24/7 expert guidance via email and WhatsApp
- Returns: 7-day return policy on manufacturing defects only
Buy RL-058 RELIFE 3 in 1 Chip Solder Set For PCB Online in India
Purchase the RL-058 RELIFE 3 in 1 Chip Solder Set For PCB online at The Engineer Store, India's trusted source for genuine electronics. We deliver across Bengaluru, Mumbai, Delhi, Chennai, Hyderabad, Pune, Kolkata, Ahmedabad, Jaipur, and Surat. Get the best price on RL-058 RELIFE 3 in 1 Chip Solder Set For PCB with fast shipping and expert support.
Our team in Bengaluru is available 24/7 to support your journey from product selection to project completion.
RL-058 RELIFE 3 in 1 Chip Solder Set For PCB
The RL-058 RELIFE 3 in 1 Chip Solder Set is a professional-grade soldering solution designed for precision PCB rework, chip-level repairs, and micro-soldering applications on smartphones, tablets, and embedded systems. Electronics repair technicians, PCB assembly professionals, and mobile phone repair specialists rely on this comprehensive set to perform reliable solder joints on BGA, QFP, and fine-pitch components. This product solves the critical challenge of achieving consistent solder quality while minimizing thermal damage to sensitive PCB substrates and adjacent components during rework operations.
Product Overview
The RL-058 RELIFE 3 in 1 Chip Solder Set combines three essential soldering materials in one integrated package: lead-free solder paste, flux-cored solder wire, and liquid flux concentrate. This tri-component system works synergistically to ensure optimal wetting characteristics, reduced oxidation, and superior joint integrity across various PCB rework scenarios. The solder formulation meets RoHS compliance standards while maintaining excellent flowability at controlled temperatures, preventing cold solder joints and bridging defects that commonly occur in micro-soldering applications.
What distinguishes the RL-058 from standard soldering kits is its specifically engineered viscosity profile for chip-level work, where precision and minimal thermal impact are paramount. The included flux has been formulated to activate at lower temperatures, reducing the thermal stress window and protecting nearby components from heat damage. The solder paste exhibits excellent stencil printability and maintains consistent particle size distribution, critical for achieving uniform solder joints on densely populated PCBs. Professional repair centers across India choose this set for its reliability in high-volume rework environments and its consistent performance across seasonal temperature variations.
Key Specifications
| Specification | Details |
| Product Type | 3 in 1 Soldering Kit - Solder Paste, Solder Wire, and Flux |
| Brand | RELIFE |
| Origin | Original/Authentic |
| Warranty | 7 days on manufacturing defects |
| Shipping | 1-5 days from Bengaluru |
| Delivery | 7-8 days across India |
| Support | 24/7 via Email and WhatsApp |
| Solder Composition | Lead-free Sn/Ag/Cu alloy, RoHS compliant |
| Melting Point | 217-220 degrees Celsius |
| Flux Type | No-clean, water-soluble formulation |
| Solder Paste Viscosity | Optimized for micro-soldering applications |
Key Features
- Three-in-one comprehensive soldering solution eliminating the need for separate purchases and ensuring chemical compatibility across all components
- Lead-free solder paste with superior wetting characteristics and reduced bridging tendency on fine-pitch components and BGA pads
- Flux-cored solder wire with consistent core ratio for reliable joint formation during manual soldering and touch-up operations
- Professional-grade liquid flux concentrate with low residue formulation, reducing post-solder cleaning requirements and improving PCB aesthetics
- Optimized activation temperature profile minimizing thermal stress on sensitive IC packages and substrate materials
- Extended shelf life with proper storage, maintaining consistent performance across multiple rework projects
Applications and Use Cases
- Smartphone and tablet PCB rework including charging port repairs, power management IC replacements, and audio codec soldering on damaged boards
- Laptop and notebook motherboard repairs involving CPU, GPU, and memory module reballing and micro-soldering operations
- Industrial embedded systems and IoT device assembly where precision soldering and thermal management are critical for long-term reliability
- Consumer electronics repair including gaming consoles, smartwatches, and portable audio devices requiring fine-pitch component replacement
- PCB prototyping and small-batch manufacturing where consistent solder quality directly impacts device functionality and lifespan
- Educational and training environments for electronics repair technicians learning advanced micro-soldering techniques on real-world PCB assemblies
How to Use
Begin by preparing your PCB surface through thorough cleaning with isopropyl alcohol and a soft brush to remove oxidation and contaminants that prevent proper solder wetting. Apply a thin layer of the liquid flux concentrate directly onto the pads or components requiring soldering, then use the solder paste with a fine-tip applicator or micro-dispenser for precise placement on BGA pads or QFP leads. Heat the assembly using a controlled heat source such as a hot air station or infrared preheater, bringing the PCB to approximately 150-180 degrees Celsius before applying the soldering iron tip to the joint area.
Once the solder paste reaches its melting point, feed the flux-cored solder wire into the joint while maintaining consistent iron temperature between 350-380 degrees Celsius. The flux will activate automatically, promoting solder flow and wetting across the pad surface. Remove the iron once the solder forms a shiny, cone-shaped joint with smooth transitions to the pad edges. For BGA rework, apply solder paste to all ball positions, position the component carefully, and use a preheating profile followed by reflow heating to ensure simultaneous melting of all joints. Allow the assembly to cool naturally to room temperature before applying any mechanical stress or conducting electrical testing.
Frequently Asked Questions
What is the difference between lead-free and lead-based solder in the RL-058 set?
The RL-058 RELIFE set uses lead-free solder composition compliant with RoHS regulations, featuring a higher melting point of 217-220 degrees Celsius compared to traditional lead-based solder at 183 degrees Celsius. Lead-free formulations provide superior mechanical strength and thermal fatigue resistance, making them ideal for modern PCBs with fine-pitch components. However, they require slightly higher soldering temperatures and more precise flux management to achieve optimal wetting characteristics. The included flux in this set is specifically engineered to compensate for these requirements, ensuring reliable joints even with lead-free solder.
Can the RL-058 solder paste be used with stencil printing for mass production?
Yes, the solder paste component of the RL-058 set is specifically formulated for stencil printability with consistent viscosity and particle size distribution. The paste maintains excellent release characteristics from stencil apertures and exhibits minimal slump during the printing process. For optimal results with stencil printing, ensure your stencil thickness matches the component pitch and pad size, typically 0.125mm for fine-pitch applications. The paste remains workable for approximately 8-12 hours after stencil printing before oxidation begins to degrade print quality, making it suitable for both small-batch and moderate-volume production runs.
How should I store the RL-058 solder set to maintain product quality?
Store the solder paste in an airtight container at room temperature between 15-25 degrees Celsius, away from direct sunlight and moisture sources. Solder paste typically maintains optimal performance for 6-12 months from the manufacturing date when stored properly. The flux concentrate should be kept in its original sealed container to prevent evaporation of volatile components that affect activation temperature and wetting behavior. Solder wire should be stored in a dry environment and can remain usable for extended periods if protected from oxidation. Before using materials stored for extended periods, verify their performance on scrap PCB samples to ensure they meet your quality standards.
When will I receive my order?
Orders are dispatched within 1-5 business days from our Bengaluru warehouse. Delivery takes 7-8 days to most locations across India.
What is your return and warranty policy?
We offer a 7-day return policy on manufacturing defects only. Contact support within 7 days of receipt for free replacement or full refund. Not applicable for user damage or misuse.
Are bulk discounts available?
Yes, wholesale pricing for orders of 10 or more units. Contact our sales team via WhatsApp or email for a customized bulk quote.
Why Buy from The Engineer Store
- Genuine Products: Sourced directly from authorized distributors with authentication
- Expert Team: Our technical team validates every product before listing
- Fast Shipping: Dispatched within 1-5 days from our Bengaluru warehouse
- Pan-India Delivery: 7-8 days to Mumbai, Delhi, Chennai, Hyderabad, Pune, Kolkata
- Payment Options: COD, UPI, credit/debit cards, net banking, EMI available
- Technical Support: 24/7 expert guidance via email and WhatsApp
- Returns: 7-day return policy on manufacturing defects only
Buy RL-058 RELIFE 3 in 1 Chip Solder Set For PCB Online in India
Purchase the RL-058 RELIFE 3 in 1 Chip Solder Set For PCB online at The Engineer Store, India's trusted source for genuine electronics. We deliver across Bengaluru, Mumbai, Delhi, Chennai, Hyderabad, Pune, Kolkata, Ahmedabad, Jaipur, and Surat. Get the best price on RL-058 RELIFE 3 in 1 Chip Solder Set For PCB with fast shipping and expert support.
Our team in Bengaluru is available 24/7 to support your journey from product selection to project completion.